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IPC TM-650 2.6.8.1: Thermal Stress, Laminate
Abstract: To determine the resistance of the laminate to thermal stress in both the etched and unetched state.
IPC TM-650 2.2.7A: Hole Size Measurement, Plated
Abstract: To measure the inside diameter of plated through holes in printed wiring boards.
IPC TM-650 2.4.46A: Spread Test, Liquid, Paste or Solid Flux, or Flux Extracted from Solder Paste, Cored Wires or Preforms
Abstract: This test method will give an indication of activity of wave solder fluxes, core solder fluxes, and solder paste.
IPC TM-650 2.5.5.8: Low Frequency Dielectric Constant and Loss Tangent, Polymer Films
Abstract: This test method establishes a procedure for determining the low frequency out of plane dielectric constant and loss tangent of organic free films using a two-fluid method. (Low frequency is defined as less than or equal ...
IPC TM-650 2.4.42.2: Die Shear Strength
Abstract: The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted elements to package headers or other substrates. This determination is based on a measure ...
IPC TR-585: Time, Temperature and Humidity Stress of Final Board Finish Solderability
Abstract: PURPOSE
The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust ...
The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust ...
IPC TM-650 2.4.26: Tape Test for Additive Printed Boards
Abstract: This test method shall establish and define the methods for predicting the bond strength, on a go-no-go basis, of additive rigid epoxy glass boards of the swelletchable type.
IPC 6011 GERMAN: English -- Generic Performance Specification for Printed Boards
Abstract: Diese Spezifikation legt die allgemeinen Anforderungen an Leiterplatten sowie die Anforderungen an die Qualitätsund Zuverlässigkeitssicherung fest, die für ihre Beschaffung eingehalten werden müssen. ...
IPC J-STD-006B CHINESE: English -- Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Incorporating Amendment 1: 1/2008 and Amendment 2: 10/2009
Abstract: This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ...