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Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:50:30Z
date available2017-09-04T18:50:30Z
date copyright04/01/2008
date issued2008
identifier otherANWDGCAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std/handle/yse/231994
description abstractThis document describes materials that can be used for the fabrication of embedded resistor devices within the finished printed circuit board substrate. It provides information on general classifications and associated characteristics of embedded passive device (EPD) materials. This document shall be used as a qualification and conformance standard for designers and users when designing or constructing printed circuit boards containing EPD materials. For this document, embedded passive devices and the phrase embedded passives are considered to be equivalent.
This document contains embedded resistor material designation, conformance (requirements), qualification (characterization) and quality assurance specifications. IPC-4811 should be used in conjunction with IPC-2000 series design standards and IPC-6010 series qualification and performance standards.
Embedded capacitor material designation, conformance (requirements), qualification (characterization) and quality assurance specifications are contained in IPC-4821.
languageEnglish
titleIPC 4811num
titleSpecification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boardsen
typestandard
page32
statusActive
treeIPC - Association Connecting Electronics Industries:;2008
contenttypefulltext


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