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IPC TM-650 2.4.12A
Solderability, Edge Dip Method
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:59:48Z | |
| date available | 2017-09-04T17:59:48Z | |
| date copyright | 06/01/1991 | |
| date issued | 1991 | |
| identifier other | FVAVNAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jse/handle/yse/182866 | |
| description abstract | This method is used to determine the solderability of copper foil, copper clad laminate, and printed boards. This method does not specifically relate to the solderability of the internal plating in holes. | |
| language | English | |
| title | IPC TM-650 2.4.12A | num |
| title | Solderability, Edge Dip Method | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1991 | |
| contenttype | fulltext |
