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Passive Electronic Component Parts, Test Methods for; Method 11: Thermal Shock in Ai

contributor authorECIA - Electronic Components Industry Association
date accessioned2017-09-04T16:35:21Z
date available2017-09-04T16:35:21Z
date copyright28764
date issued1978
identifier otherUZSRCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jse/handle/yse/98838
description abstractPURPOSE
This test is conducted for the purpose of determining the resistance of a component part to exposures at ! extremes of high and low temperatures in air, and to the shock of alternate exposures to these extremes. Permanent changes in operating characteristics and physical damage produced during thermal shock result principally from variations in dimensions and other physical properties. Effects of thermal shock include cracking and delamination of finishes, cracking and crazing of embedding and encapsulating compounds, opening of terminal seals and case seams, leakage of filling materials, and change in electrical characteristics- due to mechanical displacement or rupture of conductors or of insulating materials.
languageEnglish
titleECA 186-11Enum
titlePassive Electronic Component Parts, Test Methods for; Method 11: Thermal Shock in Aien
typestandard
page5
statusActive
treeECIA - Electronic Components Industry Association:;1978
contenttypefulltext


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