IPC TM-650 2.4.23

Soldering Resistance of Laminate Materials

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T18:38:09Z
date available	2017-09-04T18:38:09Z
date copyright	03/01/1979
date issued	1979
identifier other	JPBWCAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;jsein=autho4/handle/yse/219967
description abstract	This test method is used to determine the resistance of laminate materials (both unclad and etched surfaces) to the thermal abuse of a solder dip. Resistance to softening, loss of surface resin, scorching, delamination, blistering and measling are considered in the evaluation.
language	English
title	IPC TM-650 2.4.23	num
title	Soldering Resistance of Laminate Materials	en
type	standard
page	2
status	Active
tree	IPC - Association Connecting Electronics Industries:;1979
contenttype	fulltext