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BS EN IEC 63378-2-2 Thermal standardization on semiconductor packages. Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages
BS EN IEC 63378-2-2
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BSI - British Standards Institution
Year: 2025
BSI - British Standards Institution
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BS EN IEC 63378-2-2 Thermal standardization on semiconductor packages. Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages
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| contributor author | BSI - British Standards Institution | |
| date accessioned | 2025-09-30T21:47:31Z | |
| date available | 2025-09-30T21:47:31Z | |
| date copyright | 07 February 2025 | |
| date issued | 2025 | |
| identifier isbn | - | |
| identifier other | 000000000030510059.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsein=authtria/handle/yse/347048 | |
| language | English | |
| publisher | BSI - British Standards Institution | |
| title | BS EN IEC 63378-2-2 Thermal standardization on semiconductor packages. Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages | en |
| title | BS EN IEC 63378-2-2 | num |
| type | Standard | |
| page | 29 | |
| status | Current | |
| tree | BSI - British Standards Institution:;2025 | |
| contenttype | Fulltext |