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Lessons Learned – Thermal Sensor Installation Failures Remain a Problem (2003)

contributor authorNASA - National Aeronautics and Space Administration (NASA)
date accessioned2017-09-04T18:17:17Z
date available2017-09-04T18:17:17Z
date copyright38646
date issued2005
identifier otherHOXCQCAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsery=autho162s7D8308/handle/yse/200143
description abstractAbstract:
There is an extensive history of resistance thermal device (RTD) failures on NASA and DOD missions due to thermally-induced mechanical stress. Recent MER ground and in-flight failures, including some failures in mission critical MER applications, suggest that these devices remain sensitive to variations in the mounting configuration. Perform Package Qualification Verification (PQV) for all critical RTD applications. For non-critical applications, develop standard, flight qualified installations and methods, and track the part pedigree.
languageEnglish
titleNASA-LLIS-1739num
titleLessons Learned – Thermal Sensor Installation Failures Remain a Problem (2003)en
typestandard
page4
statusActive
treeNASA - National Aeronautics and Space Administration (NASA):;2005
contenttypefulltext
subject keywordsAdditional Categories.Flight Equipment
subject keywordsAdditional Categories.Hardware
subject keywordsAdditional Categories.Payloads
subject keywordsAdditional Categories.Spacecraft
subject keywordsAdditional Categories.Test & Verification
subject keywordsAdditional Categories.Test Article


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