درباره ما
IPC TM-650 2.4.24.5
Glass Transition Temperature and Thermal Expansion of Materials Used in High Density Interconnection (HDI) and Microvias - TMA Method
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:03:19Z | |
| date available | 2017-09-04T17:03:19Z | |
| date copyright | 36100 | |
| date issued | 1998 | |
| identifier other | XWRXHAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=autho162s7D83081DAC426159DD6EFDEC014A/handle/yse/126881 | |
| description abstract | This test is designed to determine the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) of dielectric materials used in high density interconnect (HDI) and microvias by the use of thermal mechanical analysis (TMA). For isotropic (unreinforced) materials, either method (A = thick specimen; B = thin specimen) may be used. For anisotropic materials (reinforced), both methods shall be used, since the z axis expansion (Method A) is not the same as the x-y axis expansion (Method B). | |
| language | English | |
| title | IPC TM-650 2.4.24.5 | num |
| title | Glass Transition Temperature and Thermal Expansion of Materials Used in High Density Interconnection (HDI) and Microvias - TMA Method | en |
| type | standard | |
| page | 5 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1998 | |
| contenttype | fulltext |
