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IPC TM-650 2.4.29C
Solder Mask - Adhesion to Flexible Circuits
Organization:
IPC - Association Connecting Electronics Industries
Year: 2007
Abstract: This test method is used to determine the adhesion quality of solder masks used on flexible circuits.
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IPC TM-650 2.4.29C
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:04:57Z | |
| date available | 2017-09-04T17:04:57Z | |
| date copyright | 03/01/2007 | |
| date issued | 2007 | |
| identifier other | YBHVACAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=autho162s7D83081DAC426159DD6EFDEC014A/handle/yse/128568 | |
| description abstract | This test method is used to determine the adhesion quality of solder masks used on flexible circuits. | |
| language | English | |
| title | IPC TM-650 2.4.29C | num |
| title | Solder Mask - Adhesion to Flexible Circuits | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2007 | |
| contenttype | fulltext |