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IPC 6017
Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
Organization:
IPC - Association Connecting Electronics Industries
Year: 2009
Abstract: Statement of Scope This specification covers qualification and performance of in-process and finished printed boards (PBs) containing embedded passive circuitry with distributive capacitive planes, capacitive or resistive components.
Purpose The requirements contained herein are intended to reflect electrical, mechanical, and environmental properties unique to embedded passives. It is not intended to specify overall requirements for the PB which are already documented in the following sectional performance specifications: IPC-6012 (rigid), IPC-6013 (flex/ rigid-flex), IPC-6015 (MCM-L) or IPC-6018 (microwave).
Purpose The requirements contained herein are intended to reflect electrical, mechanical, and environmental properties unique to embedded passives. It is not intended to specify overall requirements for the PB which are already documented in the following sectional performance specifications: IPC-6012 (rigid), IPC-6013 (flex/ rigid-flex), IPC-6015 (MCM-L) or IPC-6018 (microwave).
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:08:08Z | |
| date available | 2017-09-04T17:08:08Z | |
| date copyright | 03/01/2009 | |
| date issued | 2009 | |
| identifier other | YJPOLCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsein=autho47037D8369B7AC426159DD6E273C9FCD/handle/yse/131661 | |
| description abstract | Statement of Scope This specification covers qualification and performance of in-process and finished printed boards (PBs) containing embedded passive circuitry with distributive capacitive planes, capacitive or resistive components. Purpose The requirements contained herein are intended to reflect electrical, mechanical, and environmental properties unique to embedded passives. It is not intended to specify overall requirements for the PB which are already documented in the following sectional performance specifications: IPC-6012 (rigid), IPC-6013 (flex/ rigid-flex), IPC-6015 (MCM-L) or IPC-6018 (microwave). | |
| language | English | |
| title | IPC 6017 | num |
| title | Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices | en |
| type | standard | |
| page | 20 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2009 | |
| contenttype | fulltext |