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Surface Insulation Resistance

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:16:14Z
date available2017-09-04T17:16:14Z
date copyright03/01/2007
date issued2007
identifier otherZFHVACAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsery=autho162s7D83081DAC426159DD6EFDEC014A/handle/yse/139674
description abstractThis test method is used to quantify the deleterious effects of fabrication, process or handling residues on Surface Insulation Resistance (SIR) in the presence of moisture. The electrodes are long parallel traces (printed interdigitated comb patterns) on a standardized printed board or assembly. Samples shall be conditioned and measurements taken at a high humidity. Electrodes are electrically biased during conditioning to facilitate electrochemical reactions.
Specifically, this method is designed to:
• Simultaneously assess
a) leakage current caused by ionized water films and
b) electrochemical degradation of test vehicle, (corrosion, dendritic growth).
• Provide metric(s) that can appropriately be used for binary classification (e.g., go/no go, pass/fail).
• Compare, rank or characterize materials and processes.
languageEnglish
titleIPC TM-650 2.6.3.7num
titleSurface Insulation Resistanceen
typestandard
page4
statusActive
treeIPC - Association Connecting Electronics Industries:;2007
contenttypefulltext


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