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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 241-260 of 793
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IPC SMC-WP-004
Abstract: INTRODUCTION
The fundamental measures of success for any business are economic. The Electronics Industry has provided rapid improvements in technologies and capabilities that have provided enormous ... -
IPC 4204A
Abstract: This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and ... -
IPC TM-650 2.5.31
Abstract: This test procedure is to determine the current leakage through overglaze films by application of current flow across two electrodes and measurement of the amperage developed. -
IPC J-STD-013
Abstract: This document establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/ high pin count I/C packages. Included is information on design principles, ... -
IPC J-STD-001E GERMAN
Abstract: Scope This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial ... -
IPC SM-817
Abstract: This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the printed wiring ... -
IPC TM-650 2.6.16
Abstract: This procedure is a rapid means for evaluating glass epoxy laminate integrity on different lots of base laminate materials before placing materials on the production floor, and thereby reducing the cost of processing ... -
IPC J-STD-030
Abstract: This document provides users of underfill material with guidance in selecting and evaluating underfill material. Underfill material is used to increase reliability of electronic devices by two methods: alleviate CTE mismatch ... -
IPC 2511B
Abstract: This standard specifies the XML schema that represents the data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, inspection and ... -
IPC 2514A
Abstract: This standard specifies data formats used to describe drawing methodologies for printed boards and printed board assemblies. These formats may be used for transmitting information between a printed board designer and a ... -
IPC TM-650 2.2.10A
Abstract: This is a nondestructive test that may be used at any time during the preproduction phase of printed wiring board manufacturing. -
IPC 2141A
Abstract: This guide is intended to be used by circuit designers, packaging engineers, printed board fabricators, and procurement personnel so that all may have a common understanding of each other’s area.
The goal in ... -
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IPC A-600G ITALIAN
Abstract: This document describes the preferred, acceptable, and non-conforming conditions that are either externally or internally observable on printed boards. It represents the visual interpretation of minimum requirements set ... -
IPC 4563
Abstract: This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.