درباره ما
MIL-P-70661
POTTED CIRCUIT CARD ASSEMBLY FOR TOW-2/E6 PROBE AND S&A ASSEMBLY
| contributor author | ARMY - AR - US Army Research Devlp & Engr Command, Armament Research Devlp & Engr Center | |
| date accessioned | 2017-09-04T18:06:20Z | |
| date available | 2017-09-04T18:06:20Z | |
| date copyright | 04/27/1987 | |
| date issued | 1987 | |
| identifier other | GMAPDAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=autho162sear79D40AC42/handle/yse/189286 | |
| description abstract | This specification contains the requirements, quality assurance provisions, testing and packaging of an electronic assembly for TOW-2/E6 Probe and S&A Assembly. Intended Use: The Potted Circuit Card Assemblies covered by this specification are intended for use in TOW-2/E6 Probe and S&A Assembly. | |
| language | English | |
| title | MIL-P-70661 | num |
| title | POTTED CIRCUIT CARD ASSEMBLY FOR TOW-2/E6 PROBE AND S&A ASSEMBLY | en |
| type | standard | |
| page | 27 | |
| status | Active | |
| tree | ARMY - AR - US Army Research Devlp & Engr Command, Armament Research Devlp & Engr Center:;1987 | |
| contenttype | fulltext | |
| subject keywords | Certificate of Conformance | |
| subject keywords | Circuit card assembly potting | |
| subject keywords | Control drawing | |
| subject keywords | Data item description (DID) | |
| subject keywords | Lot quality confirmation testing | |
| subject keywords | Printed wiring board | |
| subject keywords | Process control | |
| subject keywords | Qualified suppliers | |
| subject keywords | Quality conformance | |
| subject keywords | Soldering | |
| subject keywords | TOW-2/E6 Probe and S&A Assembly |
