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Method 21 Test Standard for Electromechanical Switches: Environmental Effects of Machine Soldering Using an Infrared System

contributor authorECIA - Electronic Components Industry Association
date accessioned2017-09-04T16:02:59Z
date available2017-09-04T16:02:59Z
date copyright09/01/1989
date issued1989
identifier otherROZOCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsery=autho4703177D081D20686159DD6EFDEC9FCDoginin/handle/yse/66153
description abstractPURPOSE
The purpose of this standard is to evaluate electromechanical surface-mountable components which have been subjected to the environmental effects of machine soldering using an infrared system.
This standard shall not be construed as a production procedure in machine soldering operations.
The solderability determination is made on the basis of an effective bond between the component terminals and the printed wiring board.
The acceptable performance of a component subjected to this test is determined by visual examination and those tests specified to be performed upon completion of the test.
This test deals with infrared soldering and cleaning operations only, and does not consider additional factors in the assembly of surface mounted devices such as oven drying of soldering pastes.
languageEnglish
titleECA EIA-448-21num
titleMethod 21 Test Standard for Electromechanical Switches: Environmental Effects of Machine Soldering Using an Infrared Systemen
typestandard
page7
statusActive
treeECIA - Electronic Components Industry Association:;1989
contenttypefulltext


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