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ECA EIA-540ABAA
Detail Specification for Chip Carrier Sockets for Plastic Quad Flat Pack 0.635 mm (.025") Lead Spacing (Gullwing)
Organization:
ECIA - Electronic Components Industry Association
Year: 1997
Abstract: The Chip Carrier Sockets of assessed quality covered by this detail specification shall have:
a) Maximum enclosure dimensions that include cover and latching hardware as illustrated in Figure 1.
b) A working voltage not exceeding 125 volts (rms)
c) Current not exceeding 1 ampere per pin.
OBJECT
The object of this detail specification is to provide all information required for the identification and quality assessment of the Chip Carrier Sockets for Plastic Quad Flat Packages (PQFP) with lead spacings on 0.635 mn (.025l1) and "gullwing" shaped leads. The information, contained herein or by reference, is complete and sufficient for inspection purposes.
a) Maximum enclosure dimensions that include cover and latching hardware as illustrated in Figure 1.
b) A working voltage not exceeding 125 volts (rms)
c) Current not exceeding 1 ampere per pin.
OBJECT
The object of this detail specification is to provide all information required for the identification and quality assessment of the Chip Carrier Sockets for Plastic Quad Flat Packages (PQFP) with lead spacings on 0.635 mn (.025l1) and "gullwing" shaped leads. The information, contained herein or by reference, is complete and sufficient for inspection purposes.
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ECA EIA-540ABAA
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T16:11:39Z | |
| date available | 2017-09-04T16:11:39Z | |
| date copyright | 03/01/1991 (R 1997) | |
| date issued | 1997 | |
| identifier other | SMPKCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=autho4703177D081D20686159DD6EFDEC9FCDoginin/handle/yse/74835 | |
| description abstract | The Chip Carrier Sockets of assessed quality covered by this detail specification shall have: a) Maximum enclosure dimensions that include cover and latching hardware as illustrated in Figure 1. b) A working voltage not exceeding 125 volts (rms) c) Current not exceeding 1 ampere per pin. OBJECT The object of this detail specification is to provide all information required for the identification and quality assessment of the Chip Carrier Sockets for Plastic Quad Flat Packages (PQFP) with lead spacings on 0.635 mn (.025l1) and "gullwing" shaped leads. The information, contained herein or by reference, is complete and sufficient for inspection purposes. | |
| language | English | |
| title | ECA EIA-540ABAA | num |
| title | Detail Specification for Chip Carrier Sockets for Plastic Quad Flat Pack 0.635 mm (.025") Lead Spacing (Gullwing) | en |
| type | standard | |
| page | 17 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1997 | |
| contenttype | fulltext |