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Blank Detail Specification: Sockets for Pin Grid Array Devices with 2.54 mm X 2.54 mm (0.1" X 0.1") Spacing for Use in Electronic Equipment

contributor authorECIA - Electronic Components Industry Association
date accessioned2017-09-04T16:18:54Z
date available2017-09-04T16:18:54Z
date copyright10/01/1990 (R 1997)
date issued1997
identifier otherTGRYCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsery=autho4703177D081D20686159DD6EFDEC9FCDoginin/handle/yse/82341
description abstractThe Pin Grid Array Sockets of assessed quality covered by this detail specification have:
1. Maximum enclosure of (maximum length, width, and height dimensions).
2. A working voltage of (highest working voltage).
3. Current rating not exceeding-ampere per pin.
Object
The object of this detail specification is to provide all information required for the indentification and quality assesement of the Pin Grid Array Socket described herein by the EIA. The information, contained herein or by reference, is complete and sufficient for inspection purposes.
languageEnglish
titleECA 540BA00num
titleBlank Detail Specification: Sockets for Pin Grid Array Devices with 2.54 mm X 2.54 mm (0.1" X 0.1") Spacing for Use in Electronic Equipmenten
typestandard
page29
statusActive
treeECIA - Electronic Components Industry Association:;1997
contenttypefulltext


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