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Peel Strength, Flexible Printed Wiring Materials

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:21:49Z
date available2017-09-04T17:21:49Z
date copyright32417
date issued1988
identifier otherZUFTCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jse/handle/yse/145017
description abstractThis test method defines the procedure for determining the bond strength of copper foil clad flexible dielectric material.
languageEnglish
titleIPC TM-650 2.4.9Dnum
titlePeel Strength, Flexible Printed Wiring Materialsen
typestandard
page5
statusActive
treeIPC - Association Connecting Electronics Industries:;1988
contenttypefulltext


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