درباره ما
IPC TM-650 2.3.24
Porosity of Gold Plating (Chemical Method)
Organization:
IPC - Association Connecting Electronics Industries
Year: 1978
Abstract: This test method provides procedures to determine the porosity of gold plating on both copper and nickel surfaces by chemical means. This method may also be used to test rhodium or palladium.
Collections
:
-
Statistics
IPC TM-650 2.3.24
Show full item record
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:26:15Z | |
| date available | 2017-09-04T17:26:15Z | |
| date copyright | 02/01/1978 | |
| date issued | 1978 | |
| identifier other | CJOGCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho1216177D9D40527369727A00D52FAB6A/handle/yse/149308 | |
| description abstract | This test method provides procedures to determine the porosity of gold plating on both copper and nickel surfaces by chemical means. This method may also be used to test rhodium or palladium. | |
| language | English | |
| title | IPC TM-650 2.3.24 | num |
| title | Porosity of Gold Plating (Chemical Method) | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1978 | |
| contenttype | fulltext |