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IPC TM-650 2.4.25C
Glass Transition Temperature and Cure Factor by DSC
Organization:
IPC - Association Connecting Electronics Industries
Year: 1994
Abstract: This test method is designed to determine the glass transition temperature of dielectric materials used in printed boards by differential scanning calorimetry (DSC). It is suitable for prepreg, metallic clad or unclad laminate, and printed boards. It also provides a determination of relative degree of cure, or Cure Factor, for some types of materials.
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IPC TM-650 2.4.25C
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:29:42Z | |
| date available | 2017-09-04T17:29:42Z | |
| date copyright | 34669 | |
| date issued | 1994 | |
| identifier other | CSWFCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/152758 | |
| description abstract | This test method is designed to determine the glass transition temperature of dielectric materials used in printed boards by differential scanning calorimetry (DSC). It is suitable for prepreg, metallic clad or unclad laminate, and printed boards. It also provides a determination of relative degree of cure, or Cure Factor, for some types of materials. | |
| language | English | |
| title | IPC TM-650 2.4.25C | num |
| title | Glass Transition Temperature and Cure Factor by DSC | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1994 | |
| contenttype | fulltext |