IPC TM-650 2.5.32
Resistance Test, Plated Through Holes
contributor author | IPC - Association Connecting Electronics Industries | |
date accessioned | 2017-09-04T17:34:41Z | |
date available | 2017-09-04T17:34:41Z | |
date copyright | 32112 | |
date issued | 1987 | |
identifier other | DFYXCAAAAAAAAAAA.pdf | |
identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/157572 | |
description abstract | To determine the change in resistance of plated through-holes after being subjected to repeated thermal cycling conditions. | |
language | English | |
title | IPC TM-650 2.5.32 | num |
title | Resistance Test, Plated Through Holes | en |
type | standard | |
page | 2 | |
status | Active | |
tree | IPC - Association Connecting Electronics Industries:;1987 | |
contenttype | fulltext |