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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 261-280 of 793
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IPC TM-650 2.4.42
Abstract: This procedure establishes the performance and test guidelines for the break-off torque of adhesives used by placement equipment to attach surface mounted devices to printed wiring boards. -
IPC TM-650 2.4.1.5A
Abstract: This procedure describes three methods to determine the level of treatment transfer for treated copper foil. -
IPC IPC/JEDEC J-STD-075
Abstract: This standard outlines worst case industry solder (SnPb and Pb-free) assembly process limits for nonsemiconductor electronic components (hereafter referred to as ‘‘components'') along with commodity specific ... -
IPC IPC/WHMA-A-620A SPANISH
Abstract: Este estándar es una colección de requerimientos de calidad, visuales, eléctricos y mecánicos, para Ensambles de Arneses de Cable y Alambre. Ha sido preparado por el Comité de Guías Técnicas ... -
IPC IPC/JPCA-6801
Abstract: This standard specifies printed wiring boards (PWBs) manufactured by the build-up process used primarily for electronic equipment (hereinafter build-up/high density interconnect (HDI) PWBs). The build-up/HDI PWB, as referred ... -
IPC IPC/JPCA-6202
Abstract: This standard covers the requirements and considerations for single- and double-sided flexible printed wiring boards (hereinafter called ‘‘flexible printed boards'' or FPC). In this document, a FPC means a ... -
IPC MI-660
Abstract: INTRODUCTION
There are three major purposes for these guidelines on incoming inspection of raw material. They are:
• To provide background information on uses of specific raw materials, citing applicable ... -
IPC TM-650 2.1.6.1
Abstract: This method is designed to determine the weight of a fabric by use of a small specimen. It is appropriate for woven or nonwoven fabrics made with glass or other inorganic yarns, or made with organic fibers or yarns. -
IPC TM-650 2.4.2.1D
Abstract: With this test method the flexural fatigue life for any given bend radius, the flexural fatigue behavior and the ductility in percent deformation after tensile failure can be determined.
Note: The indirect determination ... -
IPC TM-650 2.6.7A
Abstract: The purpose of this method is to determine the physical endurance of printed boards to sudden exposure to extreme changes in temperature and the effect of alternate exposures to these extremes. The exposure of the printed ... -
IPC D-279
Abstract: This document establishes design concepts, guidelines, and procedures intended to promote appropriate ‘Design for Reliability (DfR)’ procedures and to ensure reliable printed wiring assembly (PWA) characteristics. ... -
IPC D-322
Abstract: Purpose. This specification defines guidelines for choosing sizes of printed wiring boards, using standard fabrication panel sizes.
Recommendation. While this document should be helpful in establishing areas of ... -
IPC 5702
Abstract: Every electronics manufacturer, whether an original equipment manufacturer (OEM) or contract manufacturer (CM), will be faced with determining if the unpopulated printed boards used in the finished assembly have an adequate ... -
IPC 4562A
Abstract: This specification covers metal foils supported by carrier films and unsupported foils suitable for subsequent use in printed boards. Unless otherwise agreed upon between user and supplier (AABUS), metal foils sh ... -
IPC HDBK-001E
Abstract: The Standard sets forth practices and requirements for the assembly, soldering processes, soldered connections, cleaning, coating/encapsulation, rework, and verification of soldered electrical and electronic assemblies. ... -
IPC TM-650 2.3.30A
Abstract: This test method is used to measure pH in anhydrous fluorocarbon azeotropes and blends in cleaning and defluxing equipment. This method does not work in the presence of organic acid acceptors normally present with chlorinated ... -
IPC TM-650 2.3.19C
Abstract: This test method is designed to measure the volatile content of prepreg used as bonding plies in the manufacture of laminate and printed boards.