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Introduction to Tape Automated Bonding & Fine Pitch Technology

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:46:45Z
date available2017-09-04T17:46:45Z
date copyright01/01/1989
date issued1989
identifier otherEMWECAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/169941
languageEnglish
titleIPC SMC-TR-001num
titleIntroduction to Tape Automated Bonding & Fine Pitch Technologyen
typestandard
page73
statusActive
treeIPC - Association Connecting Electronics Industries:;1989
contenttypefulltext


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