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IPC 2225
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
Organization:
IPC - Association Connecting Electronics Industries
Year: 1998
Abstract: This standard establishes requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of organic mounting structure used to interconnect chip components, which in combination form the completed functional Single Chip Module (SCM-L), MCM, or MCM-L assemblies.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:48:12Z | |
| date available | 2017-09-04T17:48:12Z | |
| date copyright | 05/01/1998 | |
| date issued | 1998 | |
| identifier other | EQNEDAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/171387 | |
| description abstract | This standard establishes requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of organic mounting structure used to interconnect chip components, which in combination form the completed functional Single Chip Module (SCM-L), MCM, or MCM-L assemblies. | |
| language | English | |
| title | IPC 2225 | num |
| title | Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies | en |
| type | standard | |
| page | 32 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1998 | |
| contenttype | fulltext |