IPC 9502

PWB Assembly Soldering Process Guideline for Electronic Components

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T18:03:08Z
date available	2017-09-04T18:03:08Z
date copyright	04/01/1999
date issued	1999
identifier other	GDNIJAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/186097
description abstract	This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9503, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents, listed in applicable documents. Note: This document does not address the increased temperature requirements of lead-free solders.
language	English
title	IPC 9502	num
title	PWB Assembly Soldering Process Guideline for Electronic Components	en
type	standard
page	23
status	Active
tree	IPC - Association Connecting Electronics Industries:;1999
contenttype	fulltext