IPC TM-650 2.5.33
Measurement of Electrical Overstress from Soldering Hand Tools
Organization:
IPC - Association Connecting Electronics Industries
Year: 1998
Abstract: EOS and electrostatic discharge (ESD) have been proven to damage and degrade electronic components and assemblies. This test method consists of a series of individual test procedures to test soldering and desoldering hand tools with grounded working surfaces for electrical grounds, transient voltages, and current leakage. This series of test methods attempts to identify those benchtop systems, which might contribute to premature assembly failure from EOS/ESD related failure mechanisms. Test results may be erroneous or skewed if they are incorrectly performed, influenced by outside forces (e.g., air conditioning discharge over the unit under test), or if incorrect test equipment is selected. Test equipment selected for equipment qualification must be capable of measuring the low voltages and current emitted by the unit under test (UUT). Additionally, the equipment must be capable of reading pulses and frequencies emitted by the UUT, which may be oscillator or microprocessor controlled. As faster and more capable oscillator and microprocessor controlled equipment is introduced by equipment manufacturers, it may become necessary to select test equipment with a broader bandwidth than that currently specified in this procedure. Failure to do so is likely to qualify equipment that might otherwise be disqualified. Several of these tests can be falsely influenced by radio frequency interference and electromagnetic interference from lighting and equipment found in the workplace and testing area. To avoid these influences the leakage and transient tests should be performed in a screen room. In lieu of a screen room, a separate test procedure (see Test Method 2.5.33.4) has been provided to make a low cost shielded enclosure which should provide adequate shielding for the performance of these test procedures.
Warning: These are laboratory test procedures that may of necessity expose terminals that carry line voltages. All standard laboratory safety procedures regarding the setup and performance of tests with line voltage equipment must be observed at all times.
Caution: These tests are performed with soldering systems at their normal operating temperature. Test personnel must take adequate precautionary steps to protect themselves and others from potential burns.
Warning: These are laboratory test procedures that may of necessity expose terminals that carry line voltages. All standard laboratory safety procedures regarding the setup and performance of tests with line voltage equipment must be observed at all times.
Caution: These tests are performed with soldering systems at their normal operating temperature. Test personnel must take adequate precautionary steps to protect themselves and others from potential burns.
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IPC TM-650 2.5.33
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contributor author | IPC - Association Connecting Electronics Industries | |
date accessioned | 2017-09-04T18:08:24Z | |
date available | 2017-09-04T18:08:24Z | |
date copyright | 36100 | |
date issued | 1998 | |
identifier other | GRSXHAAAAAAAAAAA.pdf | |
identifier uri | http://yse.yabesh.ir/std;jse/handle/yse/191421 | |
description abstract | EOS and electrostatic discharge (ESD) have been proven to damage and degrade electronic components and assemblies. This test method consists of a series of individual test procedures to test soldering and desoldering hand tools with grounded working surfaces for electrical grounds, transient voltages, and current leakage. This series of test methods attempts to identify those benchtop systems, which might contribute to premature assembly failure from EOS/ESD related failure mechanisms. Test results may be erroneous or skewed if they are incorrectly performed, influenced by outside forces (e.g., air conditioning discharge over the unit under test), or if incorrect test equipment is selected. Test equipment selected for equipment qualification must be capable of measuring the low voltages and current emitted by the unit under test (UUT). Additionally, the equipment must be capable of reading pulses and frequencies emitted by the UUT, which may be oscillator or microprocessor controlled. As faster and more capable oscillator and microprocessor controlled equipment is introduced by equipment manufacturers, it may become necessary to select test equipment with a broader bandwidth than that currently specified in this procedure. Failure to do so is likely to qualify equipment that might otherwise be disqualified. Several of these tests can be falsely influenced by radio frequency interference and electromagnetic interference from lighting and equipment found in the workplace and testing area. To avoid these influences the leakage and transient tests should be performed in a screen room. In lieu of a screen room, a separate test procedure (see Test Method 2.5.33.4) has been provided to make a low cost shielded enclosure which should provide adequate shielding for the performance of these test procedures. Warning: These are laboratory test procedures that may of necessity expose terminals that carry line voltages. All standard laboratory safety procedures regarding the setup and performance of tests with line voltage equipment must be observed at all times. Caution: These tests are performed with soldering systems at their normal operating temperature. Test personnel must take adequate precautionary steps to protect themselves and others from potential burns. | |
language | English | |
title | IPC TM-650 2.5.33 | num |
title | Measurement of Electrical Overstress from Soldering Hand Tools | en |
type | standard | |
page | 5 | |
status | Active | |
tree | IPC - Association Connecting Electronics Industries:;1998 | |
contenttype | fulltext |