IPC TM-650 2.4.36C

Rework Simulation, Plated-Through Holes for Leaded Components

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T18:12:29Z
date available	2017-09-04T18:12:29Z
date copyright	05/01/2004
date issued	2004
identifier other	HCPHFBAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/195478
description abstract	This test method is used to simulate the procedures for plated-through hole (PTH) component removal and replacement, in order to determine the effects of rework on the quality and integrity of the PTH barrel and conductor foil on bare rigid or flexible printed boards. The five steps are designed to simulate initial soldering after a preconditioning bake and two subsequent replacements.
language	English
title	IPC TM-650 2.4.36C	num
title	Rework Simulation, Plated-Through Holes for Leaded Components	en
type	standard
page	2
status	Active
tree	IPC - Association Connecting Electronics Industries:;2004
contenttype	fulltext