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Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description [BDTST]

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:13:46Z
date available2017-09-04T18:13:46Z
date copyright36831
date issued2000
identifier otherHFUSFBAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoCA5893FD081D206861598F1EFDEC014A/handle/yse/196690
description abstractThis standard specifies data formats used to describe printed board assembly in-circuit testing methodologies. These formats may be used for transmitting information between printed circuit board designers and printed board manufacturers. The formats are also useful when the manufacturing cycle includes computer-aided processes and numerical control machines. The information can be used for both manual and for digital interpretation. The data may be defined in either English or SI units.
languageEnglish
titleIPC 2515Anum
titleSectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description [BDTST]en
typestandard
page20
statusActive
treeIPC - Association Connecting Electronics Industries:;2000
contenttypefulltext


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