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Results of Copper Foil Rupture Strength Test Round Robin Study

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:17:45Z
date available2017-09-04T18:17:45Z
date copyright03/01/1991
date issued1991
identifier otherHPVQCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/200517
languageEnglish
titleIPC TR-485num
titleResults of Copper Foil Rupture Strength Test Round Robin Studyen
typestandard
page30
statusActive
treeIPC - Association Connecting Electronics Industries:;1991
contenttypefulltext


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