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Measurement of Electrical Overstress from Soldering Hand Tools - Ground Measurements

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:18:13Z
date available2017-09-04T18:18:13Z
date copyright36100
date issued1998
identifier otherHQWXHAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/200931
description abstractThis test method describes the measurement of the DC tip-to-ground resistance of an electric hand soldering/ desoldering tool designed with a grounded tip. Measurement of tip-to-ground AC reactance is outside the scope of this test method. Also, measurement of soft grounded or equipment with insulated tips is outside the scope of this test method. There are three times when ground testing should be done: Equipment qualification for purchase Incoming inspection of new or repaired equipment Process monitoring (periodic checks) Determination of tip-to-ground resistance is accomplished by using a basic ohmmeter circuit, passing a current through the tip and its grounding circuit and measuring the resultant voltage drop. The values used in this test eliminate error caused by the Seebeck (thermocouple) effect.
Warning This is a laboratory test procedure that may, of necessity, expose terminals that carry line voltages. All standard laboratory safety procedures regarding the setup and performance of tests with line voltage equipment must be observed at all times. .
Caution This test is performed with soldering systems at their normal operating temperature. Test personnel must take adequate precautionary steps to protect themselves and others from potential burns.
languageEnglish
titleIPC TM-650 2.5.33.1num
titleMeasurement of Electrical Overstress from Soldering Hand Tools - Ground Measurementsen
typestandard
page3
statusActive
treeIPC - Association Connecting Electronics Industries:;1998
contenttypefulltext


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