درباره ما
IPC TM-650 2.3.7.1A
Cupric Chloride Etching Method
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:23:01Z | |
| date available | 2017-09-04T18:23:01Z | |
| date copyright | 34669 | |
| date issued | 1994 | |
| identifier other | ICYTCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/205427 | |
| description abstract | This method is a means for preparation of test specimens for determination of bare dielectric material quality and properties, using cupric chloride as the etching solution for removal of copper cladding. | |
| language | English | |
| title | IPC TM-650 2.3.7.1A | num |
| title | Cupric Chloride Etching Method | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1994 | |
| contenttype | fulltext |
