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Test Point Locations for Printed Wiring Assemblies

contributor authorECIA - Electronic Components Industry Association
date accessioned2017-09-04T18:43:04Z
date available2017-09-04T18:43:04Z
date copyright01/01/1958 (R 1983)
date issued1983
identifier otherKAXWCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsessionid=190419C4AB017808E65B78A0B48BF7AE/handle/yse/224479
description abstractAll test points shall be compatible in ali respects with the latest issue of EIA Standard RS-188, Standard Dimensional System for Automation Requirements.
All test points shall be brought out to any three edges of the printed wiring board whenever possible.
There are two preferred test-point location systems, A and B. A third system, C, can be used when it is impractical to bring the test points to the edge of the board.
languageEnglish
titleECA 213num
titleTest Point Locations for Printed Wiring Assembliesen
typestandard
page4
statusActive
treeECIA - Electronic Components Industry Association:;1983
contenttypefulltext


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