ECA EIA-540AD00

Blank Detail Specification for Adaptor - Carrier Quad Flat Pack to Pin Grid Array Sockets for Use in Electronic Equipment

contributor author	ECIA - Electronic Components Industry Association
date accessioned	2017-09-04T17:58:06Z
date available	2017-09-04T17:58:06Z
date copyright	10/01/1991 (R 1997)
date issued	1997
identifier other	FQQRCAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;jsessionid=1B3B0A6C0B951B52313BCC19D636B19D/handle/yse/181204
description abstract	The Quad Flatpack Carrier of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure dimensions (See Figure 1). b) Working voltage not to exceed - voits (rrns). e) Current not to exceed - amperes per pin or semiconductor package manufacturer's recommendations OBJECT The object of this Detail Specification is to provide all information required, using Sectional Specification EIA-540A000 as a base, for the identification and quality assessment of Quad Flatpack Carrier for surface mount devices having-or-lead spacing, interfacing to pin grid anay sockets on 2.54 mm X 2.54 mm (.100 in. X .100 in.) pitch. The information contained herein or by reference is complete and sufficient for inspection purposes. This device is designed to be used with EIA-540 documents, EIA-540BAAA, EIA-540BAAB, EIA-540BACC and EIA-540BAAD.
language	English
title	ECA EIA-540AD00	num
title	Blank Detail Specification for Adaptor - Carrier Quad Flat Pack to Pin Grid Array Sockets for Use in Electronic Equipment	en
type	standard
page	16
status	Active
tree	ECIA - Electronic Components Industry Association:;1997
contenttype	fulltext