IPC 6018C

English -- Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-10-18T11:09:46Z
date available	2017-10-18T11:09:46Z
date copyright	2016.07.01
date issued	2016
identifier other	XBZERFAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;jsessionid=22E9669814B1A2CD62B816A309F4CAB6/handle/yse/235823
description abstract	Scope: Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers. Purpose The purpose of this specification is to provide requirements for qualification and performance of high frequency (microwave) printed boards.
language	English
title	IPC 6018C	num
title	English -- Qualification and Performance Specification for High Frequency (Microwave) Printed Boards	en
type	standard
page	64
status	Active
tree	IPC - Association Connecting Electronics Industries:;2016
contenttype	fulltext