English -- Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-506: General test methods for materials and assemblies – An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501 - Edition 1.0

Abstract

Scope: This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-μm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 μm and 500 μm.