درباره ما
ECA 540B000
Sectional Specification Sockets for Pin Grid Array Devices With 2.54 mm x 2.54 mm (0.1" x 0.1") Spacing for Use in Electronic Equipment
Organization:
ECIA - Electronic Components Industry Association
Year: 1997
Abstract: This sectional specification relates to the sockets for Pin Grid Array devices of assessed quality. The purpose of this specification is to provide a means of interchange ability between qualified devices and compatibility between the board and the Pin Grid Array device.
To provide standard socket test methods, gauges and performance requirements.
Object
The object of this specification is to define:
a) Aunified numbering system t o be used f o r Pin Grid Array sockets standardized by the Electronic Industries Association ( E I A ) .
b) Functional levels and standard test methods and gauges for use in t h e examination of these sockets.
c) Appropriate reference dimensions of the mating devices and board layout to establish intermateability and interchangeability criteria as specified in the detail.
Test severities and performance requirements prescribed in the detail specifications referring to this sectional specification shall be equal to orgreater than those specified herein ; degradations a r e not permitted.
To provide standard socket test methods, gauges and performance requirements.
Object
The object of this specification is to define:
a) Aunified numbering system t o be used f o r Pin Grid Array sockets standardized by the Electronic Industries Association ( E I A ) .
b) Functional levels and standard test methods and gauges for use in t h e examination of these sockets.
c) Appropriate reference dimensions of the mating devices and board layout to establish intermateability and interchangeability criteria as specified in the detail.
Test severities and performance requirements prescribed in the detail specifications referring to this sectional specification shall be equal to orgreater than those specified herein ; degradations a r e not permitted.
Collections
:
Show full item record
| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T18:47:35Z | |
| date available | 2017-09-04T18:47:35Z | |
| date copyright | 04/01/1989 (R 1997) | |
| date issued | 1997 | |
| identifier other | KMIWCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho47037D83081DAC4241668F1E350F130D0Facilities%20Engine/handle/yse/228756 | |
| description abstract | This sectional specification relates to the sockets for Pin Grid Array devices of assessed quality. The purpose of this specification is to provide a means of interchange ability between qualified devices and compatibility between the board and the Pin Grid Array device. To provide standard socket test methods, gauges and performance requirements. Object The object of this specification is to define: a) Aunified numbering system t o be used f o r Pin Grid Array sockets standardized by the Electronic Industries Association ( E I A ) . b) Functional levels and standard test methods and gauges for use in t h e examination of these sockets. c) Appropriate reference dimensions of the mating devices and board layout to establish intermateability and interchangeability criteria as specified in the detail. Test severities and performance requirements prescribed in the detail specifications referring to this sectional specification shall be equal to orgreater than those specified herein ; degradations a r e not permitted. | |
| language | English | |
| title | ECA 540B000 | num |
| title | Sectional Specification Sockets for Pin Grid Array Devices With 2.54 mm x 2.54 mm (0.1" x 0.1") Spacing for Use in Electronic Equipment | en |
| type | standard | |
| page | 23 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1997 | |
| contenttype | fulltext |