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IPC TM-650 2.6.7.3
Thermal Shock - Solder Mask
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:36:27Z | |
| date available | 2017-09-04T18:36:27Z | |
| date copyright | 07/01/2000 | |
| date issued | 2000 | |
| identifier other | JLCGQAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessiouth=179893FDFCDCAC4/handle/yse/218366 | |
| description abstract | This test method is to determine the physical endurance of applied polymer solder mask to sudden changes of high and low temperature excursions to cause physical fatigue. | |
| language | English | |
| title | IPC TM-650 2.6.7.3 | num |
| title | Thermal Shock - Solder Mask | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2000 | |
| contenttype | fulltext |
