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IPC TM-650 2.4.14
Solderability of Metallic Surfaces
Organization:
IPC - Association Connecting Electronics Industries
Year: 1973
Abstract: The purpose of this test is to determine the solderability of printed circuit boards (PCBs) that are to be joined by a soldering operation employing rosin flux and immersion in molten solder or by use of a soldering iron.
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IPC TM-650 2.4.14
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:55:47Z | |
| date available | 2017-09-04T15:55:47Z | |
| date copyright | 04/01/1973 | |
| date issued | 1973 | |
| identifier other | QWBKCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=autho162/handle/yse/59142 | |
| description abstract | The purpose of this test is to determine the solderability of printed circuit boards (PCBs) that are to be joined by a soldering operation employing rosin flux and immersion in molten solder or by use of a soldering iron. | |
| language | English | |
| title | IPC TM-650 2.4.14 | num |
| title | Solderability of Metallic Surfaces | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1973 | |
| contenttype | fulltext |