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IPC TR-486
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-Layer Seperations
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:23:05Z | |
| date available | 2017-09-04T18:23:05Z | |
| date copyright | 07/01/2001 | |
| date issued | 2001 | |
| identifier other | IDCVWAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessioutho1513AF67081D20686159DD6EFDEC014A/handle/yse/205481 | |
| description abstract | The scope of this test program includes a study of the repeatability and reproducibility of IST and thermal stress test method to determine the presence of inner-layer separations, development of guidelines for the use of IST testing and test data as a substitute for thermal stress testing in acceptance of product for shipment and to generate a report assessing all pertinent criteria of the program purpose. | |
| language | English | |
| title | IPC TR-486 | num |
| title | Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-Layer Seperations | en |
| type | standard | |
| page | 56 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2001 | |
| contenttype | fulltext |
