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English -- Monotonic Bend Characterization of Board-Level Interconnects;
Chinese -- 板极互连的单向弯曲特性描述

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:31:29Z
date available2017-09-04T18:31:29Z
date copyright06/01/2004
date issued2004
identifier otherIYYKNEAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/213716
languageChinese
titleIPC IPC/JEDEC-9702 CHINESEnum
titleEnglish -- Monotonic Bend Characterization of Board-Level Interconnectsen
titleChinese -- 板极互连的单向弯曲特性描述other
typestandard
page28
statusActive
treeIPC - Association Connecting Electronics Industries:;2004
contenttypefulltext


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