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IPC TM-650 2.4.23
Soldering Resistance of Laminate Materials
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:38:09Z | |
| date available | 2017-09-04T18:38:09Z | |
| date copyright | 03/01/1979 | |
| date issued | 1979 | |
| identifier other | JPBWCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessioutho1513AF67081D20686159DD6EFDEC014A/handle/yse/219967 | |
| description abstract | This test method is used to determine the resistance of laminate materials (both unclad and etched surfaces) to the thermal abuse of a solder dip. Resistance to softening, loss of surface resin, scorching, delamination, blistering and measling are considered in the evaluation. | |
| language | English | |
| title | IPC TM-650 2.4.23 | num |
| title | Soldering Resistance of Laminate Materials | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1979 | |
| contenttype | fulltext |
