MIL-DTL-11484/170C

Abstract

This specification is approved for use by all Departments and Agencies of the Department of Defense. <br>The requirements for acquiring the product described herein shall consist of this specification sheet and the issue of MIL-DTL-11484 listed in that issue of the Department of Defense Index of Specifications and Standards (DoDISS) specified in the solicitation. <a><img alt="FIGURE" /></a> </span><pre>MATERIAL: DASH NO. BASE: -1: Certificate of Distinction -1: Gilding Metal -2: Certificate of Merit -2: Red Brass -3: Certificate of Achievement DEVICE: Red Brass FINISH: -1: BASE: Hard Enameled, Nickel Plated, Silver Plated, oxidized, Relieved, Matte Finish, Lightly Polished Highlights and shall match TIOH Metal Finish Chip Number 15. DEVICE: Gold Plated, Light Rose Gold Plated, Matte Finish, Lightly Polished Highlights.</pre> <br> <pre> -2: BASE: Hard Enameled, Gold Plated, Light Rose Gold Plated, matte Finish, Lightly Polished Highlights. DEVICE: Gold Plated, Light Rose Gold Plated, Matte Finish, Lightly Polished Highlights. -3: BASE: Hard Enameled, Nickel Plated, Silver Plated, oxidized, Relieved, Matte Finish, Lightly Polished Highlights and shall match TIOH Metal Finish Chip Number 15. DEVICE: Nickel Plated, Silver Plated, Oxidized, Relieved, Matte Finish, Lightly Polished Highlights and shall match TIOH Metal Finish Chip Number 15. DIMENSIONS: BASE: HEIGHT (Overall): &#8541; inch (1.59 cm) (REF) WIDTH (Overall): &#8541; inch (1.59 cm) (REF) THICKNESS (At Thickest Point): 0.070 inch &#177; 0.065 inch (0.178 cm &#177; 0.012 cm) DEVICE: HEIGHT (Overall): 9/32 inch (0.71 cm) (REF) WIDTH (Overall): &#189; inch (1.27 cm) (REF) THICKNESS (At Thickest Point): 0.075 inch &#177; 0.005 inch (0.191 cm &#177; 0.012 cm) ASSEMBLED THICKNESS (At Thickest Point): 0.155 inch &#177; 0.005 inch (0.394 cm &#177; 0.012 cm)</pre> <br> <br>NOTES: <br>1. The term (REF) refers to the measurements taken from the Government furnished hub or die. <br>2. Enameled area shall be blue as indicated. The color shall conform to the TIOH color chip number 33 or the standard sample. <br>3. Epoxy resin (stoning epoxy) may be used in lieu of hard enamel at the option of the manufacturer. <br>4.The device shall be superimposed and secured to the shield by two rivets or soft soldered. When rivets are used, they shall be solid and shall be fabricated from any type brass. The rivets shall be located on and soldered to the vertical center line of the device. The rivets may be an integral part of the device. The device shall be located as shown. <br>5. All lapel buttons shall be lacquered. <br>6. Attaching device shall be prong with pick and ball type clutch. The prong shall be centered on the reverse side and fused or soldered to the lapel button. <br>CHANGES FROM PREVIOUS ISSUE: Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extent of the changes. <br>