JEDEC JEP131B

Abstract

This publication applies to electronic components and subassemblies product and or process development, manufacturing processes and the associated performance requirements in customer applications. These areas should include, but are not limited to: package design, chip design, process development, assembly, fabrication, manufacturing, materials, quality, service, and suppliers, as well as the process requirements needed for the next assembly. <br>The purpose of this document is to establish a minimum guideline for the application of Failure Mode and Effects Analysis techniques to improve quality, reliability, and/or consistency of electronic components subassemblies by continually evaluating the product and or process against potential failure modes. OEMs must provide suppliers with their manufacturing processes, their use conditions on the failed parts, and their failure experience(s). Suppliers must seek continuous improvement and have the responsibility of developing and improving the elements of FMEA.