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IEC 61191-2
English -- Printed board assemblies ? Part 2: Sectional specification ? Requirements for surface mount soldered assemblies - Edition 3.0
| contributor author | IEC - International Electrotechnical Commission | |
| date accessioned | 2017-10-18T11:08:14Z | |
| date available | 2017-10-18T11:08:14Z | |
| date copyright | 2017.05.01 | |
| date issued | 2017 | |
| identifier other | VFBDZFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/235463 | |
| description abstract | Scope: This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. throughhole, chip mounting, terminal mounting, etc.). | |
| language | English | |
| title | IEC 61191-2 | num |
| title | English -- Printed board assemblies ? Part 2: Sectional specification ? Requirements for surface mount soldered assemblies - Edition 3.0 | en |
| type | standard | |
| page | 38 | |
| status | Active | |
| tree | IEC - International Electrotechnical Commission:;2017 | |
| contenttype | fulltext |
