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English -- Materials for printed boards and other interconnecting structures ? Part 2-44: Reinforced base materials clad and unclad ? Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly - Edition 1.0;
French -- Mat‚riaux pour circuits imprim‚s et autres structures d'interconnexion ? Partie 2-44: Mat‚riaux de base renforc‚s, plaqu‚s et non plaqu‚s ? Feuilles stratifi‚es renforc‚es en verre de type E tiss‚/non-tiss‚ ‚poxyde non halog‚n‚, plaqu‚es cuivre, d?inflammabilit‚ d‚finie (essai de combustion verticale) pour les assemblages sans plomb - Edition 1.0

contributor authorIEC - International Electrotechnical Commission
date accessioned2017-10-18T11:11:52Z
date available2017-10-18T11:11:52Z
date copyright2016.05.01
date issued2016
identifier otherZKNTPFAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/236293
description abstractScope: This part of IEC 61249 gives requirements for properties of non-halogenated epoxide nonwoven reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of nonhalogenated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material will be supplied.
languageEnglish, French
titleIEC 61249-2-44num
titleEnglish -- Materials for printed boards and other interconnecting structures ? Part 2-44: Reinforced base materials clad and unclad ? Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly - Edition 1.0en
titleFrench -- Mat‚riaux pour circuits imprim‚s et autres structures d'interconnexion ? Partie 2-44: Mat‚riaux de base renforc‚s, plaqu‚s et non plaqu‚s ? Feuilles stratifi‚es renforc‚es en verre de type E tiss‚/non-tiss‚ ‚poxyde non halog‚n‚, plaqu‚es cuivre, d?inflammabilit‚ d‚finie (essai de combustion verticale) pour les assemblages sans plomb - Edition 1.0other
typestandard
page46
statusActive
treeIEC - International Electrotechnical Commission:;2016
contenttypefulltext


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