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|French -- Normalisation Mecanique Des Dispositifs A Semiconducteurs - Partie 4: Systeme De Codification Et Classification En Formes Des Boitiers Pour Dispositifs A Semiconducteurs - Edition 3.1; Consolidated reprintMechanical Standardization of Semicondu

contributor authorIEC - International Electrotechnical Commission
date accessioned2018-07-31T09:58:30Z
date available2018-07-31T09:58:30Z
date copyright2018.03.01
date issued2018
identifier otherPFWXEGAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/264622
description abstractThis part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.
languageEnglish
languageFrench
titleIEC 60191-4num
title|French -- Normalisation Mecanique Des Dispositifs A Semiconducteurs - Partie 4: Systeme De Codification Et Classification En Formes Des Boitiers Pour Dispositifs A Semiconducteurs - Edition 3.1; Consolidated reprintMechanical Standardization of Semiconduen
typestandard
page158
statusActive
treeIEC - International Electrotechnical Commission:;2018
contenttypefulltext


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