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IEC 62047-30

Semiconductor devices – Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film - Edition 1.0

Organization:
IEC - International Electrotechnical Commission
Year: 2017

Abstract: This part of IEC 62047 specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film used for micro sensors and micro actuators, and its reporting schema to determine the characteristic parameters for consumer, industry or any other applications of piezoelectric devices. This document applies to piezoelectric thin films fabricated by MEMS process.
URI: http://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/264831
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    IEC 62047-30

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contributor authorIEC - International Electrotechnical Commission
date accessioned2018-07-31T09:58:48Z
date available2018-07-31T09:58:48Z
date copyright2017.09.01
date issued2017
identifier otherWOTECGAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/264831
description abstractThis part of IEC 62047 specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film used for micro sensors and micro actuators, and its reporting schema to determine the characteristic parameters for consumer, industry or any other applications of piezoelectric devices. This document applies to piezoelectric thin films fabricated by MEMS process.
languageEnglish
titleIEC 62047-30num
titleSemiconductor devices – Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film - Edition 1.0en
typestandard
page24
statusActive
treeIEC - International Electrotechnical Commission:;2017
contenttypefulltext
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