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IEC 61191-4

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies - Edition 3.0

Organization:
IEC - International Electrotechnical Commission
Year: 2017

Abstract: This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
URI: http://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/264925
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    IEC 61191-4

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contributor authorIEC - International Electrotechnical Commission
date accessioned2018-07-31T09:58:56Z
date available2018-07-31T09:58:56Z
date copyright2017.07.01
date issued2017
identifier otherAJQYAGAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/264925
description abstractThis part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
languageEnglish
titleIEC 61191-4num
titlePrinted board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies - Edition 3.0en
typestandard
page24
statusActive
treeIEC - International Electrotechnical Commission:;2017
contenttypefulltext
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