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IEC 61191-4
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies - Edition 3.0
| contributor author | IEC - International Electrotechnical Commission | |
| date accessioned | 2018-07-31T09:58:56Z | |
| date available | 2018-07-31T09:58:56Z | |
| date copyright | 2017.07.01 | |
| date issued | 2017 | |
| identifier other | AJQYAGAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/264925 | |
| description abstract | This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting). | |
| language | English | |
| title | IEC 61191-4 | num |
| title | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies - Edition 3.0 | en |
| type | standard | |
| page | 24 | |
| status | Active | |
| tree | IEC - International Electrotechnical Commission:;2017 | |
| contenttype | fulltext |
