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HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, EXTRUDED - REV 1

contributor authorAIA/NAS - Aerospace Industries Association of America Inc.
date accessioned2017-09-04T17:14:27Z
date available2017-09-04T17:14:27Z
date copyright01/31/2013
date issued2013
identifier otherZAPRBFAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;quein/handle/yse/137874
languageEnglish
titleAIA/NAS NAS4122num
titleHEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, EXTRUDED - REV 1en
typestandard
page10
statusActive
treeAIA/NAS - Aerospace Industries Association of America Inc.:;2013
contenttypefulltext


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