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HEAT SINK, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, PRESS-ON TYPE - Rev 1

contributor authorAIA/NAS - Aerospace Industries Association of America Inc.
date accessioned2017-09-04T15:49:46Z
date available2017-09-04T15:49:46Z
date copyright06/30/2011
date issued2011
identifier otherQFAPMEAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;quein/handle/yse/52802
languageEnglish
titleAIA/NAS NAS4119num
titleHEAT SINK, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, PRESS-ON TYPE - Rev 1en
typestandard
page9
statusActive
treeAIA/NAS - Aerospace Industries Association of America Inc.:;2011
contenttypefulltext


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